CMC - Continuous Micro Casting Deposition

Focuses on metals and alloys including; Silver, Copper, Indium, Tin, Zinc, Lithium, and their alloys target recoating to cut costs. Patent Pending: U.S. Application Serial No. 62/839,095

Electron beam based melting of wire to build material on exterior of target backing tubes. Low thermal impact on target backing tubes allows for materials with different coefficients of thermal expansions to be bonded directly to each other. Process can be used to re-apply target material to targets after use.

Tpd - Thermal Plasma Deposition

In parallel with CMC development, although at a slightly staggered timeline, we are developing a secondary sputtering process that would:

• Reduce or eliminate sputter process arcing caused by grain boundaries

• Increase process deposition rates by reducing required sputtering energies

• Improve process stability by utilizing high purity materials and minimal mechanical processing

• Full density materials adhered directly to a stainless-steel backing tube

• Maximizes thermal conductivity by eliminating bonding layers

• Improve pure metal rotary target structural rigidity

Patent #: WO 2019/1111 83 A1

Junora has an exclusive world-wide license for the process, developed by Patrick Morse